1. Role of Aluminum Alloys in Semiconductor Equipment
Aluminum alloys are widely used in semiconductor equipment primarily due to:
- Lightweight properties (reducing machine inertia)
- Excellent machinability (ideal for high-precision CNC machining)
- Good thermal stability (controllable thermal deformation)
- High surface treatment compatibility (Anodizing / Plasma processes)
👉 Aluminum alloys are mainly applied to non-reactive core process areas, yet are structural and chamber components located extremely close to the process zone.
2. Common Aluminum Alloys Used in Semiconductor Equipment
| Aluminum Alloy | Characteristics | Semiconductor Applications |
|---|---|---|
| 6061-T6 | Dimensionally stable, easy to machine | Structural parts, brackets, base plates |
| 7075-T651 | High strength and rigidity | Precision frames, motion modules |
| 5083-H112 | Excellent weldability | Vacuum chambers, enclosures |
| High-Purity Aluminum (4N / 5N) | Ultra-low contamination | Internal chamber components |
3. Machining Methods for Aluminum Alloys in Semiconductor Equipment
1️⃣ CNC Machining Technologies
Machine Types
- 3-axis / 4-axis CNC (flat surfaces, frames)
- 5-axis CNC (chambers, angled holes, complex flow paths)
- High-Speed Machining Centers (HSM)
Machining Strategies
- High-speed milling with low depth of cut
- Symmetrical machining to minimize internal stress
- Rough → Stress Relief → Finish
Tool Selection
- PCD tools (for high-purity aluminum)
- DLC / ZrN-coated end mills
- High chip-evacuation tool designs
2️⃣ Specialized Machining Processes (Common in Semiconductor Industry)
- Deep cavity machining (vacuum chambers)
- Complex flow channels (gas / cooling channels)
- Thin-wall structures (lightweight with high rigidity)
- High flatness machining (≤ 10 μm / 500 mm)
4. Standard Manufacturing Process Flow for Aluminum Semiconductor Parts
Material inspection (certification & batch traceability)
↓
Rough machining
↓
Stress relief (artificial / natural aging)
↓
Semi-finishing
↓
Finish machining (5-axis)
↓
Surface treatment (Anodizing / Plasma)
↓
Precision re-inspection (CMM / flatness)
↓
Ultrasonic cleaning (DI water)
↓
Cleanroom packaging (Class 100 / 1000)
5. Key Control Points for Semiconductor-Grade Aluminum Machining
1️⃣ Dimensional Accuracy & Thermal Deformation Control (Critical)
- Allowance for deformation must be reserved before machining
- Multiple stress-relief cycles for large components
- Temperature-controlled environment (20 ±1°C)
2️⃣ Surface Quality & Contamination Control
Surface Roughness
- General structural surfaces: Ra ≤ 1.6 μm
- Vacuum / gas contact surfaces: Ra ≤ 0.8 μm
Contamination Risks
- Sulfur-containing cutting fluids prohibited
- Separation of machining and cleaning areas
- Dedicated aluminum machining lines (avoid Fe contamination)
3️⃣ Surface Treatments (Core Semiconductor Technology)
| Surface Treatment | Function | Semiconductor Application |
|---|---|---|
| Hard Anodizing (Type III) | Wear & corrosion resistance | Structural components |
| Plasma Anodizing | Low particle generation | Internal chamber parts |
| Electroless Nickel (EN) | Gas tightness / sealing | Vacuum contact surfaces |
⚠️ Anodic layer thickness must be included in tolerance calculations (typically 20–50 μm).
4️⃣ Cleaning & Cleanliness Levels
- Ultrasonic cleaning (DI water)
- Cleanroom packaging (Class 100 / 1000)
- Low-outgassing packaging materials
6. Typical Applications of Aluminum Alloys in Semiconductor Equipment
Equipment Structure
- Equipment frames
- Base plates
- Motion module housings
Process Chambers & Internal Parts
- Vacuum chambers
- Liners / shields
- Gas distribution plates (non-high-temperature areas)
Auxiliary & Fixture Components
- Wafer carriers
- Alignment jigs
- Handling arm components
7. Aluminum vs. Other Materials (Semiconductor Perspective)
| Item | Aluminum Alloy | Stainless Steel | Ceramics |
|---|---|---|---|
| Machining Efficiency | ⭐⭐⭐⭐⭐ | ⭐⭐ | ⭐ |
| Cost | Low–Medium | High | Very High |
| Weight | Light | Heavy | Medium |
| Plasma Resistance | Medium | High | Very High |
| Application Area | Structures / Chambers | Gas / High-temp | Core processes |
8. Practical Recommendations for CNC Manufacturers
What German / Global Equipment Makers Value Most
- Dimensional repeatability
- Consistent surface treatment quality
- Clean process control capability
Recommended Capability Combination
- 5-axis machining + integrated surface treatment
- Experience in deformation control of large aluminum parts
- Semiconductor-grade cleaning processes
📌 Summary
Aluminum alloys are the “structural backbone” of semiconductor equipment.
The true value of CNC machining lies in stability × cleanliness × process integration.
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Yongyi Technology Co., Ltd. de
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